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128Mx72 DDR2 SDRAM Multi-Chip Package

White Electronic Designs

Description

This 1Gbyte SDRAM, organized as 128M x 72, is packaged in a 16 x 22mm, 352mm2, 208 plastic ball grid array (PBGA). It provides high-density memory for extended-environment embedded computing, such as that used in aircraft, communications and missiles. Benefits include higher board density and routing advantages.

Company Overview

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WEDC provides standard and custom multichip semiconductor products, memory devices and build-to-print electromechanical assemblies for defense and aerospace applications. Capabilities include: turn-key design through production; manufacturing and obsolescence management; test qualification; miniaturization of existing designs; die stacking, anti-tamper and information assurance technologies.